2020 专业英语（自动化）(江汉大学)1450727715 最新满分章节测试答案

文章目录[隐藏]

6 The Package Technology of IC 单元测验
12 Wireless LAN 单元测验

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本课程起止时间为:2020-02-17到2020-07-15
本篇答案更新状态:已完结

6 The Package Technology of IC 单元测验

1、问题:The first integrated circuit was invented by ( )
选项：
A:Thomas Edison
B: Jack Kilby and Robert Noyce
C: Newton
D:Albert Einstein
答案: 【 Jack Kilby and Robert Noyce】

2、问题:Wafer preparation excludes
选项：
A:cleaning
B:layering
C:probing
D: doping
答案: 【 doping】

3、问题:The process of photolithography excludes ( )
选项：
A:coating
B: soft bake
C: slicing
D: develop
答案: 【 slicing】

4、问题:Doping excludes（）
选项：
A:diffusion
B:rounding
C:ion-implant
D:
答案: 【rounding】

5、问题:Functions of IC packaging excludes ( )
选项：
A: protection from the environment/handling
B:signal interconnections
C: slicing
D: heat dissipation
答案: 【 slicing】

6、问题:Which of the following statements is wrong? ( )
选项：
A: DIP, dual in-line package
B: SIP, single in-line package
C: PLCC, plastic in-line chip carrier
D:QFP, quad flat package
答案: 【 PLCC, plastic in-line chip carrier】

7、问题: Die attach is the physical attachment of the die to ( ) or substrate
选项：
A:lead frame
B:wafer
C: metal
D:base
答案: 【lead frame】

8、问题:The three basic types of wire bonding excludes ( )
选项：
A:thermo compression
B:ultrasonic bonding
C:thermo ultrasonic bonding
D:thermo sonic ball bonding
答案: 【thermo ultrasonic bonding】

9、问题:Tape automated bonding (TAB) uses a plastic tape as a ( )
选项：
A:substrate
B: wafer