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本课程起止时间为:2020-03-02到2020-06-30
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【作业】1. Analog and Digital Signal 1．英汉互译

1、 问题:（1）模拟（数字）信号  （                           ）（2）音频信号                  （                           ）（3）正（负）逻辑          （                           ）（4）DAC                          （                           ）（5）ADC                          （                           ）
评分规则: 【 要求按照视频讲解中的英文进行翻译。
】

【作业】2. Application of Ohm’s Law 1.英汉互译

1、 问题:（1）串联电路           （                           ）（2）并联电路           （                           ）（3）Ohm’s  law         （                           ）（4）voltage  rating       （                           ）（5）resistor/resistance     （                           ）（6）capacitor/capacitance  （                           ）（7）inductor/inductance    （                           ）（8）The equivalent capacitance is the reciprocal of sum of capacitance reciprocal.（9）In order to avoid capacitor failure, capacitors can be added and several identical capacitors can be connected in series so that the algebra of voltage rating is greater than the working voltage.（10）The drop in voltage is equal to the product of the current and the resistance ,hence it is called the IR drop.
评分规则: 【 要按照视频讲解中的表达来做翻译。
】

3. NAND GATE 第一单元测验

1、 问题:What is an analog signal?
选项：
A:Analog signal is a continuous values
B:Analog signal is a discrete values
C: Analog signal is sometimes continuous, sometimes discrete
D: 
答案: 【Analog signal is a continuous values】

2、 问题:How do we hear the amplified sound ?
选项：
A:Sound waves are picked up by a speaker and converted to a small analog voltage called the audio signal, then the voltage are sent to the microphone. 
B:Sound waves are picked up by a microphone and converted to a small analog voltage called the audio signal, then the voltage are sent to the speaker .
C:Sound waves are picked up by a microphone and converted to a small digital voltage called the audio signal, then the digital voltage are sent to the speaker 
D: 
答案: 【Sound waves are picked up by a microphone and converted to a small analog voltage called the audio signal, then the voltage are sent to the speaker .】

3、 问题:Which of the following are not correct
选项：
A:Audio signal is an analog signal.
B:Most things that can be measured quantitatively occur in nature in analog form.
C:An analog quantity is one having continuous values.
D:The air temperature is a continuous value.
答案: 【The air temperature is a continuous value.】

4、 问题:In series circuit ,the current flowing through each element is  (   )
选项：
A:of the same value
B: proportional to resistance
C:inversely proportional to resistance
D: 
答案: 【of the same value】

5、 问题:In which circuit all devices could be controlled by one switch ?
选项：
A:parallel circuit
B:series circuit 
C:series parallel circuit 
D: 
答案: 【series circuit 】

6、 问题:Which is the characteristic of parallel circuits?
选项：
A:same voltage 
B: different voltage
C:same current
D: 
答案: 【same voltage 】

7、 问题:The terminal voltage of all parallel components is of （    ）
选项：
A:the same voltage.
B:the different voltage
C:the same current
D:the different current
答案: 【the same voltage.】

8、 问题:what is IR drop?
选项：
A: the product of current and voltage
B:infrared radiation
C:investor relation
D: 
答案: 【 the product of current and voltage】

9、 问题:which is the right expression for C=A×B
选项：
A:C is the sum of A and B
B:C is equal to the product of A and B
C: 
D: 
答案: 【C is equal to the product of A and B】

10、 问题:The result of  A÷B is called (    )
选项：
A:sum
B:difference
C:quotient
D:product
答案: 【quotient】

【作业】3. NAND GATE 翻译

1、 问题:1．翻译（1）The logic gate is the basic unit of the digital logic circuit. It contains three basic logic gates and some composite logic gates.（2）   When all inputs are high (logic 1), the output is high, otherwise the output is low (logic 0).       （3）                As long as one of the inputs is high (logic 1), the output is high (logic 1). Only when all inputs are low, the output is low. （4）         The output of a NOT gate is the opposite of the input.（5）          A high output (1) results if one, and only one, of the inputs to the gate is high (1). If both inputs are low (0) or both are high (1), a low output (0) results. （6）         The XNOR gate is a digital logic gate whose function is the inverse of the exclusive XOR gate. A high output (1) results if both of the inputs to the gate are the same. If one but not both inputs are high (1), a low output (0) results. （7）     NAND gate is a combination of AND gate and NOT gate.（8）       NOR gate is a combination of OR gate and NOT gate.（9）翻译以下补充课本短语① sampling, quantizing, and coding② synchronization word③ sampling frequency  ④ Time Division Multiplexer（10）翻译以下补充课本句子① If we consider binary transmission, the complete information about a particular message will always be obtained by simply detecting the presence or absence of the pulse.  ② We have assumed that each voice channel has a separate coder, the unit that converts sampled amplitude values to a set of pulses; and decoder, the unit that performs the reverse operation ③ A high-speed electronic switch is used to present the analog information signal of each channel, taken in turn to the codec. The codec is then arranged to sequentially sample the amplitude value, and code  this value into the 8-digit sequence.
评分规则: 【 无
】

【作业】5 Manufacturing Process of Semiconductor 翻译

1、 问题:1．翻译 （1）integrated circuits （IC） （2） An IC integrates multiple electronic components on one substrate of silicon.（3）The five stages of IC fabrication① Wafer preparation: silicon is purified and prepared into wafers.② Wafer fabrication: microchips are fabricated in a wafer fab by either a merchant chip supplier, captive chip producer, fabless company or foundry.③ Wafer test: Each individual die is probed and electrically tested to sort for good or bad chips.  ④ Assembly and packaging: Each individual die is assembled into its electronic package.⑤ Final test: Each packaged IC undergoes final electrical test.（4）What are key technologies during wafer fabrication?① OxidationOxidation is the progress of growing silicon dioxide or silicon nitride on silicon.② Photo  Lithographic   Coating    （                 ）   Soft-bake   （                 ）   Exposure   （                 ）   Post-exposure bake  （                     ）   Develop    （                  ）   Hard bake   （                  ）   Develop check （                    ）  ③ EtchEtch is the method of removing the materials on silicon. The method of etch can be classified as wet etching and dry etching.  ④ DopeDoping is the method of importing impurity in silicon to change it’s electric performance.
评分规则: 【 请根据视频内容进行翻译。
】

【作业】6 The Package Technology of IC 第6课翻译

1、 问题:（1）The function of chip package ① protection from the environment/handling        ② signal interconnections③ physical support④ heat dissipation（2） Some common packages          ① DIP          ② SIP          ③ SMT         ④ BGA （3）Packaging  process  ① Back grind  ② Die separation  ③ Die attach    ④ Wire bonding  （4）Advanced  packaging  designs   ① Flip chip  ② Ball grid array(BGA)  ③ Chip on board(COB)  ④ Tape automated bonding(TAB)  ⑤ Multichip modules(MCM)   ⑥ Chip scale packaging(CSP) ⑦ Wafer-level packaging（WLP）（5）Flip chip packaging mounts the active side of a chip toward the substrate, It uses bump technology(typically solder bumps)to form the interconnection between the chip and substrate.（6）Ball grid array(BGA)uses a ceramic or plastic substrate with an area array of solder balls to connect the substrate to the circuit board.（7）Chip on board(COB)mounts IC chips directly to the substrate, along side other surface mount(SMT) or pin-in-hole(PIH) components.     （8）Tape automated bonding(TAB) uses a plastic tape as a chip carrier.  The tape has a thin copper foil that is etched to form the leads. The chip and leads are removed from the carrier prior to assembly onto the circuit board.（9）Multichip module(MCM) has several die assembled onto one substrate. This permits a higher density of chips.（10）WLP will simplify the IC packaging process and lower cost.
评分规则: 【 请按照视频讲解进行翻译。
】

6 The Package Technology of IC 第二单元测验

1、 问题:The first integrated circuit was invented by (   )
选项：
A:Thomas Edison
B: Jack Kilby and Robert Noyce
C: Newton
D:Albert Einstein  
答案: 【 Jack Kilby and Robert Noyce】

2、 问题:Wafer preparation excludes
选项：
A:cleaning
B:layering
C:probing
D: doping
答案: 【 doping】

3、 问题:The process of photolithography excludes (   )
选项：

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